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4-Channel Headset EMI Filter Array with ESD Protection CM1410
Features
* * * * * * * * * Functionally and pin compatible with the CSPEMI200A device Pi-style EMI filters in a capacitor-resistorcapacitor (C-R-C) network Four channels of EMI filtering with ESD protection Includes one channel of ESD-only protection Greater than 30dB attenuation at 1GHz +8kV ESD protection on each channel (IEC 61000-4-2 Level 4, contact discharge) +15kV ESD protection on each channel (HBM) Supports bipolar signals--ideal for audio applications Chip Scale Package features extremely low lead inductance for optimum filter and ESD performance 11-bump, 2.046mm X 1.436mm footprint Chip Scale Package (CSP) OptiguardTM coated for improved reliability at assembly RoHS-compatible, lead-free packaging
Product Description
The CM1410 is a quad low-pass filter array integrating four pi-style filters (C-R-C) that reduce EMI/RFI emissions while at the same time providing ESD protection. This device is custom-designed to interface with the headset port on a cellular telephone, and contains three different filter values. Each high quality filter provides more than 20dB attenuation in the 800-2700 MHz range. These pistyle filters support bidirectional filtering, controlling EMI both to and from the microphone and speaker elements. They also support bipolar signals, enabling audio signals to pass through without distortion. In addition, the CM1410 provides a very high level of protection for sensitive electronic components that may be subject to electrostatic discharge (ESD). The CM1410 can safely dissipate ESD strikes of +8kV, the maximum requirement of the IEC 61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the device provides protection for contact discharges to greater than +15kV. The CM1410 also includes a single channel of ESD-only protection. The CM1410 is particularly well suited for portable electronics (e.g., cellular telephones, PDAs, notebook computers) because of its small package format and low weight. The CM1410 incorporates OptiguardTM coating which results in improved reliability at assembly.The CM1410 is available in a space-saving, low-profile RoHS-compliant, Chip Scale Package.
* * *
Applications
* * * * * * * EMI filtering and ESD protection for audio ports Wireless handsets Handheld PCs / PDAs MP3 players Digital camcorders Notebooks Desktop PCs
(c)2010 SCILLC. All rights reserved. April 2010 Rev. 2
Publication Order Number: CM1410/D
CM1410
Block Diagram
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CM1410
PIN DESCRIPTIONS
PIN A1 A2 A3 A4 B1 B2 B3 B4 C1 C2 C3 C4 NAME N.B. MIC_IN2 SPKR_OUT1 SPKR_OUT2 MIC_IN1 ESD1 GND GND MIC_OUT1 MIC_OUT2 SPKR_IN1 SPKR_IN2 DESCRIPTION No Bump - used for orientation / alignment Microphone Input 2 (from microphone) Speaker Output 1 (to speaker) Speaker Output 2 (to speaker) Microphone Input 1 (from microphone) ESD Protection Input. Provides a channel specifically for ESD protection purposes. Device Ground Device Ground Microphone Output 1 (to audio circuitry) Microphone Output 2 (to audio circuitry) Speaker Input 1 (from audio circuitry) Speaker Input 2 (from audio circuitry)
Ordering Information
PART NUMBERING INFORMATION
Bumps 11 Package CSP Ordering Part Number CM1410-03CP
1
Part Marking N103
Note 1: Parts are shipped in Tape and Reel form unless otherwise specified.
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER Storage Temperature Range DC Power per Resistor DC Package Power Rating RATING -65 to +150 100 400 UNITS C mW mW
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CM1410
STANDARD OPERATING CONDITIONS
PARAMETER Operating Temperature Range RATING -40 to +85 UNITS C
ELECTRICAL OPERATING CHARACTERISTICS
SYMBOL R1 R2 R3 C1 C2 ILEAK VSIG PARAMETER Resistance 1 Resistance 2 Resistance 3 Capacitance 1 Capacitance 2 Diode Leakage Current Signal Voltage Positive Clamp Negative Clamp In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Level 4 Clamping Voltage during ESD Discharge MIL-STD-883 (Method 3015), 8kV Positive Transients Negative Transients Cut-off frequency 1; Note 5 Cut-off frequency 2; Note 5 Cut-off frequency 3; Note 5 VIN=5.0V ILOAD = 10mA 5 -15 Notes 2 and 4 15 8 Notes 2,3 and 4 CONDITIONS MIN 90 61 9 38 80
(NOTE 1)
TYP 100 68 10 47 100
MAX 110 75 11 57 120 1.0
UNITS pF pF A
7 -10
15 -5
V V
VESD
kV kV
VCL
+15 -19 R = 100, C = 47pF R = 68, C = 47pF R = 10, C = 100pF 53 61 33
V V MHz MHz MHz
fC1 fC2 fC3
Note 1: TA=25 unless otherwise specified. C Note 2: ESD applied to input pins with respect to GND, one at a time, pins A2, A3, A4, B1 and B2 only. Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin B1, then clamping voltage is measured at Pin C1. Note 4: Unused pins are left open Note 5: ZSOURCE=50, ZLOAD=50
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CM1410
Performance Information
Typical Filter Performance (nominal conditions unless specified otherwise)
Figure 1. Microphone 1 Circuit (B1-C1) EMI Filter Performance
Figure 2. Microphone 2 Circuit (A2-C2) EMI Filter Performance
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CM1410
Performance Information (Cont'd)
Typical Filter Performance (nominal conditions unless specified otherwise)
Figure 3. Speaker 1 Circuit (A3-C3) EMI Filter Performance
Figure 4. Speaker 2 Circuit (A4-C4) EMI Filter Performance
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CM1410
Application Information
PARAMETER Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (laser cut, 5% tapered walls) Solder Flux Ratio Solder Paste Type Pad Protective Finish Tolerance -- Edge To Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder Paste VALUE 0.240mm Round Non-Solder Mask defined pads 0.290mm Round 0.125mm - 0.150mm 0.300mm Round 50/50 by volume No Clean OSP (Entek Cu Plus 106A) +50m +20m 60 seconds 260 C
N on-Solder M ask D efined Pad 0.240m D m IA.
Solder Stencil Opening 0.300m D m IA.
Solder Mask Opening 0.290m D m IA.
Figure 5. Recommended Non-Solder Mask Defined Pad Illustration
Figure 6. Lead-free (SnAgCu) Solder Ball Reflow Profile
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CM1410
Mechanical Details
CSP Mechanical Specifications The CM1410 is supplied in a custom Chip Scale Package (CSP). Dimensions are presented below.
PACKAGE DIMENSIONS
Package Bumps Dim Millimeters Min A1 A2 B1 B2 C1 C2 D1 D2 Nom Max Min Custom CSP 11 Inches Nom Max
2.001 2.046 2.091 0.0788 0.0806 0.0823 1.391 1.436 1.481 0.0548 0.0565 0.0583 0.495 0.500 0.505 0.0195 0.0197 0.0199 0.495 0.500 0.505 0.0195 0.0197 0.0199 0.223 0.273 0.323 0.0088 0.0107 0.0127 0.168 0.218 0.268 0.0066 0.0086 0.0106 0.575 0.644 0.714 0.0226 0.0254 0.0281 0.368 0.419 0.470 0.0145 0.0165 0.0185 3500 pieces
Package Dimensions for CM1410 Chip Scale Package
# per tape and reel
Controlling dimension: millimeters
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CM1410
CSP Tape and Reel Specifications
POCKET SIZE (mm) B0 X A0 X K0 2.29 X 1.60 X 0.81 TAPE WIDTH W 8mm REEL DIAMETER 178mm (7") QTY PER REEL 3500
PART NUMBER CM1410
CHIP SIZE (mm) 2.05 X 1.44 X 0.644
P0 4mm
P1 4mm
Figure 7. Tape and Reel Mechanical Data
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CM1410
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
FULFILLMENT: LITERATURE FULFILLMENT Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: Phone 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: Fax 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: Email orderlit@onsemi.com Support: N. American Technical Support 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative
Rev. 2 | Page 10 of 10 | www.onsemi.com

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